Thermal Performance Study of Switch Module Redesign

Thermal analysis is performed on a proposed design change on electronic assembly to ensure that it meets customer requirements (temperature ranges) and is a more cost-effective design. Such design change should be cost efficient. The important aspect, in addition to the design, is interacting with different engineers at different positions in the company. Working with mechanical engineers and suppliers in achieving such targets and ensuring the work done is viable and on track. Furthermore, creating a technical report at the end that outlines the processes taken, the results obtained and whether the new design is satisfactory, cost wise and thermally.

Faculty Supervisor:

Kamran Behdinan

Student:

Mahtab Amiri

Partner:

Honeywell Aerospace

Discipline:

Engineering - mechanical

Sector:

Manufacturing

University:

University of Toronto